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Heat curable one-part addition organosiloxane gel E-101 fits for sealing around semiconductor elements ,especially power electronic elements ,for example , rectrifier module ,GTR, IGBT.
Condition of Cure(°C/h) 155/2-6
Usage Temperature(°C) -55 - +200
Breakdown Voltage(KV/mm, 20°C) >20
Viscosity(CS,20°C)
1000-4800
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